摘要
利用Nb/Cu/Ni复合层作中间层 ,采用液相诱导扩散连接方法连接了Si3 N4陶瓷 /Inconel6 0 0合金 ,用剪切试验评价接头强度 ,采用扫描电镜 (SEM )观察接头的断口形貌 ,系统地分析了连接压力、连接时间 ,连接温度对Si3 N4陶瓷 /Inconel 6 0 0合金液相诱导扩散连接接头的强度和断裂行为的影响。结果表明 ,连接温度 (在连接时间为30 0 0s以及连接压力为 5MPa条件下 )、连接压力 (在连接温度为 1130℃以及连接时间为 30 0 0s条件下 )和连接时间 (在连接温度为 1130℃以及连接压力为 10MPa条件下 )都与接头的剪切强度呈抛物线关系。
Bonding of Si3N4 ceramic to Inconel 600 alloy was carried out by liquid phase inductive diffusion bonding (LPIDB) method with Nb/Cu/Ni multi-interlayer. Effects of bonding condition on joint strength and fracture behavior were investigated in the paper. Joint strength was evaluated by shear test, and shear fracture surface of the joint was observed by SEM. It is shown that the parabolic relationship among the shear strength of the joint and bonding temperature (when bonding time is 3000 s and bonding pressure is 5 MPa), bonding pressure (when bonding temperature is 1130°C and bonding pressure is 10 MPa) was observed.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2003年第4期36-38,42,共4页
Transactions of The China Welding Institution
基金
山东省自然科学基金资助项目 (Z2 0 0 0F0 2 )
