应用大块液膜法处理含铜废水

Treatment of Wastewater Containing Copper with Bulk Liquid Membrane

采用烷基膦酸为载体的大块液膜体系处理含铜废水,研究了搅拌速度、料液相pH值、载体浓度、体系温度对Cu2+迁移的影响。结果表明,在搅拌速度为300～400r/min、料液相pH值控制在3.0～4.5、载体浓度为6.25%～7.5%、体系温度为288～308K的最佳工艺条件下,Cu2+的迁移率可达99.8%。

The effect of stirring speed, pH values in feed solution, concentrations of carrier and temperature of system on the transport of Cu2+ through the bulk liquid membrane with alkyphosphonic acid for copperelectroplating wastewater treatment has been studied in this paper. The results show that the transport rate of Cu2+ can reach 99.8% under the optimal technological conditions of stirring speed 300～400 r/min,pH values 3.0～4.5,carrier concentrations 6.25%～7.5% and temperature 288～308 K.