碳纳米管化学镀铜工艺的研究

Correlation Analysis of Electroless Copper Plating on the Surface of CNTs

利用化学镀的方法,在多壁碳纳米管(MWCNTs)的表面实施化学镀铜,实现碳纳米管表面金属化。用混酸(浓硫酸与浓硝酸)、浓硫酸与过氧化氢共同对多壁碳纳米管表面进行前期预处理,后续使用相同的镀液配方验证不同的预处理方法对化学镀铜镀层的影响。用透射电子显微镜、X射线衍射分析等表征方式对碳纳米管表面金属镀层进行表征。实验结果表明,在对碳纳米管进行前期预处理后,用化学镀铜的方式能够在碳纳米管表面镀覆一层金属铜,前期采用不同的预处理方式对碳纳米管表面镀铜后的镀层物质存在影响;浓硫酸与浓硝酸混酸处理的方法优于浓硫酸与过氧化氢处理的方法。

Electroless copper plating is carried out on the surface of multi-walled carbon nanotubes(mwcnts)by electroless plating method to realize the metallization of carbon nanotubes surface,which can be used to modify the surface of carbon nanotubes.Mixed acid(concentrated sulfuric acid and concentrated nitric acid)treatment,concentrated sulfuric acid and hydrogen peroxide joint treatment were used for multi-walled carbon nanotubes surface pre-pretreatment,followed by the use of the same plating solution formula to verify the impact of different pretreatment methods on the electroless copper plating coating.The metal coating on the surface of carbon nanotubes was characterized by transmission electron microscope,X-ray diffraction analysis and other characterization methods.The experimental results show that after pre-pretreatment of carbon nanotubes,a layer of metal copper can be coated on the surface of carbon nanotubes by electroless copper plating,and different pretreatment methods are used to affect the coating material after copper plating on the surface of carbon nanotubes.The treatment method of concentrated sulfuric acid and concentrated nitric acid mixed acid is better than that of concentrated sulfuric acid and hydrogen peroxide.