仿真技术在半导体和集成电路生产流程优化中的应用

Simulation technology application in optimal semiconductor and integrated circuit manufacturing process management

半导体和集成电路制造是一个流程高度复杂,资金高度密集的加工过程。集成电路制造的特殊性表现在产品工序的繁多,对设备的高利用率要求,和“再进入”(Re-entry)的流程特点。这种特殊的工艺流程特点决定了半导体集成电路工序中的排队优化选择策略比其他制造行业更为复杂,对生产效率和制造周期有更直接的影响。本文通过EXTEND仿真软件对英特尔的一个微型晶圆试验台进行初步研究,来说明计算机仿真手段在半导体集成电路生产流程优化中的作用。

The process of semiconductor and IC manufacturing is highly complex and capitalintensive. The unique complexity exhibited in semiconductor industry comes from multiple productmix, high demand for machine utilization and, 're-entry' characteristic. In addition, re-work fromquality fluctuation, batch process, flexible changeover and setup and quick response to cycle time allimpose great challenges to production scheduling and optimal resource allocation. Cycle time reduc-tion has been one of most important research subjects in semiconductor industry domestically andinternationally. By using EXTEND simulation package, research on the Mini-FAB model proposedby Intel was carried out. The simulation shows that a policy that could reduce the variability of theWIP flow among process steps would normally reduce the mean cycle time and overall variability.