动载荷下延性材料中微孔洞的增长模型

The growth of microvoids in ductile materials under dynamic loading

采用细观动力学的方法,假定基体材料不可压缩,将高加载条件下控制孔洞增长的偏微分方程组化为一阶常微分方程组,从而可利用Euler法或Runge Kutta法求解。模型的数值分析表明,对OFHC铜来说,应变硬化效应、应变率效应阻碍了孔洞的增长,热效应对孔洞增长影响不大,而环境温度的升高促进了孔洞的增长。

Using mesodynamics method and assuming the material as incompressible, the partial differential equations controlling the growth of voids under high strain rates can be deduced to ordinary differential equations, which can be solved by some existing methods such as Euler or RungeKutta method. Numerical analysis indicates that strain hardening and strain rate hardening are to resist the growth of voids, whereas the ambient temperature is to promote the growth of voids in OFHC. It is also shown that the thermal softening has negligible influence on the growth of voids.