DBC板与芯片焊接工艺中温度的确定与分析

Analysis and Determination of Temperature in Welding Process of DBC and Die

在IGBT模块生产工艺中,运用隧道炉进行陶瓷覆铜板(DBC板)与芯片的焊接,达到了理想的效果。实验结果表明,该焊接工艺中焊接温度与焊接时间的多少对焊接质量有很大影响。选择合适的焊接温度和时间,在一定的氢气保护下,可得到良好的焊接面。

In fabrication process of IGBT module,attaching Die to DBC by Tunnel-furnace achieve satisfactory results.Expermental results show that different temperature and time of welding have influence on the welding quality.Choice suitable temperature and time,in protection of determinate hydrogen,the good welding section are got.