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微压印光刻的模具制作工艺研究 被引量:2

Study on the Mold Fabrication Process for Imprint Lithography
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摘要 从模具材料研究模具制作工艺问题,通过实验研究,对比分析了有机玻璃模具和硅橡胶模具制作工艺。实验表明,可以复制出特征尺寸为0.35μm和0.1μm的有机玻璃模具和硅橡胶模具,均具有很高的复型精度。由于硅橡胶模具制作工艺在复型精度、复型精度稳定性和制作速度上均优于有机玻璃模具,且缺陷密度低于有机玻璃模具。因此,选用基于高复型精度软硅橡胶模具的软压印光刻工艺。 The fabrication processes of silicone- rubber mold and polymethyl methacrylate (PMMA) mold have been compared and analyzed.The experimental results display that the mold whose critical dimension is 0.35μm or 0.1μm can be replicated and the replication accuracy is very high.Compared with the fabrication process of PMMA mold,the silicone-rubber mold has higher replication accuracy,higher fabrication speed and lower defect density.As a result,the fabrication process of silicone-rubber mold is adopted and hence the so-called soft imprint lithography is realized.
出处 《电子工艺技术》 2003年第5期207-209,共3页 Electronics Process Technology
基金 国家自然科学基金资助项目(50275118) 国家863计划重点项目(2002AA420050)。
关键词 压印光刻 硅橡胶 有机玻璃 模具 复型 Imprint lithography Silicone-rubber PMMA Mold Replication
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参考文献3

  • 1Takashi Ito, Shinji Okazaki. Push the limits of lithography[J].Nature 2002,1027- 1031.
  • 2Pfeiffer K,Fink M. Polymer stamps for nanoimprinting[J] .Microelectronic Engineering,2002,393 - 398.
  • 3Stephen Y Chou,Peter R Krauss. Sub- 10 nm imprint lithography and applications[ J]. American vacuum society, 1997,2897 - 2898.

同被引文献16

  • 1李寒松,丁玉成,卢秉恒.步进闪光压印光刻模具制作工艺研究[J].西安交通大学学报,2006,40(3):337-340. 被引量:5
  • 2文伟力,左春柽,于建群,张学军.聚合物微流控芯片微通道模压成型分析[J].吉林大学学报(工学版),2006,36(5):696-700. 被引量:4
  • 3丁玉成,刘红忠,卢秉恒,李涤尘.下一代光刻技术——压印光刻[J].机械工程学报,2007,43(3):1-7. 被引量:13
  • 4HIRAI Y,ONISHI Y,TANABE T,et al..Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography[J].Microelectronic Engineering,2008,85:842-845.
  • 5NIKLAOS KEHAGIAS,VINCENT REBOUD,et al..Residual layer thickness in nanoimprint:Experiments and coarse-grain simulation[J].Microelectronic Engineering,2008,85:846-849.
  • 6ROWLAND H D,SUN A C,SCHUNK P R,et al..Impact of resist film thickness and cavity size on resist flow during embossing:toward process design rules for nanoimprint lithography[J].USA:Journal of Micromechanics and Microengineering,2005,15:2414-2425.
  • 7KANG T G,KWON T H.Numerical investgation of Hot Embossing Filling Characteristics[J].Resist Processing,2007:266-275.
  • 8FENG H,ANSHU G,SUN Y G,et al..Processing Dependent Vehavior of Soft Imprint Lithography on the 1-10 nm Scale[J].IEEE Transactions on Nanotechnology,2006,3(5):301-307.
  • 9李寒松.微压印中抗蚀剂、模具及图型转移工艺研究[D].西安:西安交通大学,2005.
  • 10CHOU S Y, KRAUSS P R, RENSTROM P J. Imprint of sub-25 nm vias and trenches in polymers [J]. Applied Physics Letters, 1995,67(21): 3114-3116.

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