摘要
主要就乙二胺在电刷镀铜溶液中的作用及其对镀铜层性能的影响进行了试验研究。研究结果表明:在电刷镀铜溶液中,乙二胺与铜离子的最佳摩尔浓度比为(2～3)/L。以甲基磺酸铜为主盐的电刷镀铜溶液比以硫酸铜为主盐的电刷镀铜溶液具有更快的沉积速度。
The effects of C2N2H8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper. The results obtained show that the ratio of is a key parameter which determines the performances of bath solution and the deposit. The optimized ratio range of C2N2H8/ is (2～3)/L. The depositing rate of copper brush plating solution made from Cu(CH3SO3)2 is much higher than that from CuSO5O4.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2003年第5期34-37,共4页
Surface Technology
关键词
电刷镀铜
乙二胺
电镀液
Copper brush plating
Ethylenediamine
