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DUV光致抗蚀剂的研究进展Ⅱ——光产酸源、阻溶剂等添加剂部分 被引量:1

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出处 《信息记录材料》 2003年第2期23-26,共4页 Information Recording Materials
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同被引文献9

  • 1褚战星,程龙,王文君,王力元.一种新型深紫外正型光致抗蚀剂材料的研究[J].感光科学与光化学,2006,24(5):377-381. 被引量:2
  • 2SHIDA N, OKINO T. Chemical amplified ArF resists based on menthyl acrylate copolymer protected with cleavable alicyclic group and the absorption band shift method Proc[J]. SPIE, 1998, (3333) : 10 -16.
  • 3IWASA S, NAKANO K, HASEQAWA E, et al. Photosensitive resin composition useful as resist for deep UV lithography containing sulfonium salts [P]. US:US5691111 A, 1997 -11 -25.
  • 4JUNG JCH, BOKCH K, BALK K K. Design of cycloolefin-maleic anhydride resist for ArF lithography[ J]. Proc SPIE, 1998, 3333 : 2.
  • 5HOULIHAN F M, KOMETANI JM, TIMKO A G, et al. 193nm single-layer photoresists based on alternating[ J]. Proe SPIE, 1998, 3333: 8.
  • 6ALLEN R D, WALLRATT G M, HOFER D C, et al. Photoresists for 193-nm lithography[ J]. IBMJ Res Develop, 1997, 41 : 102 -108.
  • 7WANG Li-yuan, ZHAI Xiao-xiao, HUO Yong-en. Novel 193-nm positive photoresist composed of ester acetal polymer without phenyl group[ C ]. Proc of SPIE-Advances in Resist Technology and Processing XXIV,2007,6519 -99.
  • 8WANG Li-yuan, CHU Zhan-xing, CHENG Long. Two-component photoresists based on acidolytic cleavage of novel ester acetal polymer[ C ]. Proc of SPIE-Advances in Resist Technology and Processing XXIV,2007,6519 - 100.
  • 9陈明,李元昌,洪啸吟,焦晓明,程爱萍.一种可以正负互用的水型化学增幅抗蚀剂的研究[J].高等学校化学学报,2000,21(9):1485-1488. 被引量:6

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