增强颗粒Cu对锡铅基复合钎料铺展性能的影响

Effect of enhanced particles Cu on spreading performance of Sn-Pb base solder

颗粒增强是提高合金性能的重要手段之一。增强体的不同含量对基体的性能会产生不同的影响。分析和讨论了Cu的不同体积分数对Cu颗粒增强的锡铅基复合钎料铺展性能的影响。试验结果表明:当Cu颗粒的体积分数小于1%时,随着Cu的体积分数的增加,复合钎料的铺展性能有所提高;当Cu的体积分数大于1%时,随着Cu颗粒体积分数的增加,复合钎料的铺展性能降低;当Cu颗粒的体积分数大于10%时,复合钎料的铺展性能急剧降低,且外观质量变差。

Particle-enhance is the way to improve the property of solder alloy. The content of enhanced particles has different effect on the matrix solder. In this paper, the influence of enhanced particles Cu on the wettability of 63Sn-37Pb solder with containing Cu of 0.5%(Vol) to 15%(Vol.) was investigated. It is indicated that the wettability of the composite solder can be improved by adding small amount of Cu particles. As Cu is beyond 1%(Vol.), the wettability will be decreased with increasing the adding amount of Cu. When the content of Cu particles is more than 10%(Vol.), the wettability of the composite solder is sharply deteriorated.