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Study on Interfacial Bonding State of Ag-Cu in Cold Pressure Welding 被引量:1

Study on Interfacial Bonding State of Ag-Cu in Cold Pressure Welding
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摘要 The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic test were adopted for studying the state of interfacial bonding, suggesting that the joint of Ag-Cu has not only strong welding joint but also atomic diffusion on the interface. For Ag-Cu, the interaction of dislocation caused by plastic deformation will cause the strain and the vibration of microconstructer defects, accompanied by emitting energy. The energy increases the atomic action and the amplitude of atomic vibration, and the result is that the atom can diffuse to several lattice parameters deep from interface to inner metals. Therefore, under the condition of chemical potential gradient, the special technique, cold pressure welding rather than basic requirements of diffusion should be taken into account. During the cold pressure welding, plastic deformation plays an important role for it causes the metals′ displacement, crystal defects, further activates the surface atoms. Finally, the fracture of atomic bonding leads to the atomic exchange and diffusion between the new metals′ surfaces.In other words the metals Ag,Cu can achieve solidate bonding by cold pressure welding accompanied by the atomic diffusion. Moreover, theoretical analysis and calculation on the basis of thermodynamics, crystallogy, so- lid physics,etc, have been applied to calculate the amount of atomic diffusion, which has further proved the testing results that joint Ag-Cu has strong bonding strength through the mechanism of atomic diffusion. The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic test were adopted for studying the state of interfacial bonding, suggesting that the joint of Ag-Cu has not only strong welding joint but also atomic diffusion on the interface. For Ag-Cu, the interaction of dislocation caused by plastic deformation will cause the strain and the vibration of microconstructer defects, accompanied by emitting energy. The energy increases the atomic action and the amplitude of atomic vibration, and the result is that the atom can diffuse to several lattice parameters deep from interface to inner metals. Therefore, under the condition of chemical potential gradient, the special technique, cold pressure welding rather than basic requirements of diffusion should be taken into account. During the cold pressure welding, plastic deformation plays an important role for it causes the metals′ displacement, crystal defects, further activates the surface atoms. Finally, the fracture of atomic bonding leads to the atomic exchange and diffusion between the new metals′ surfaces.In other words the metals Ag,Cu can achieve solidate bonding by cold pressure welding accompanied by the atomic diffusion. Moreover, theoretical analysis and calculation on the basis of thermodynamics, crystallogy, so- lid physics,etc, have been applied to calculate the amount of atomic diffusion, which has further proved the testing results that joint Ag-Cu has strong bonding strength through the mechanism of atomic diffusion.
出处 《Transactions of Tianjin University》 EI CAS 2003年第3期219-222,共4页 天津大学学报(英文版)
关键词 冷压焊 界面焊接状态 拉伸试验 粘结强度 原子扩散 cold pressure welding interface bonding bonding strength atomic diffusion
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