中温固化高强度高剥离无溶剂聚氨酯改性环氧树脂结构胶粘剂

Intermediate temperature setting solvent -free epoxy resin structural adhesive with high tenacity and high peeling strength modified by PU

介绍了一种无溶剂糊状聚氨酯改性环氧树脂结构胶粘剂,这种胶粘剂具有IPN结构,采用直链端异氰酸酯聚氨酯改性环氧树脂,以4,4-二氨基二苯甲烷和间苯二胺共混物为固化剂,120℃固化2h,常温剪切强度46MPa;130℃时剪切强度13.2MPa,室温剥离强度可达120KN/m,而且常温粘度低于CTBN改性环氧树脂胶粘剂,粘接强度高于CTBN改性环氧树脂胶粘剂,成本低于CTBN改性环氧树脂胶粘剂。

Review is made of an intermediate temperature setting solvent - free epoxy resin structural adhesive with high tenacity and high peeling strength modified by PU. At room temperature the shear strength of the adhesive is 46MPa, the peeling strength is 120KN/m; at 130℃ the shear strength is 13.2MPa. The room temperature viscidity of the adhesive is lower, the adhesive strength is higher, and the production cost is lower than those of the epoxy resin structural adhesive modified by CTBN.