摘要
综述了无机熔融盐电镀铝的各种熔盐组成及相关参数。探讨了无机熔融盐电镀铝的反应机理和铝枝晶的抑制 ,并介绍了无机熔融盐体系电镀铝的应用和发展前景。
Various bath compositions for electroplating of aluminium in inorganic molten salts and relevant parameters are over reviewed. The reaction mechanism and suppression of aluminium dendrites are discussed. The applications and development trend are also described.
出处
《电镀与环保》
CAS
CSCD
2003年第5期1-4,共4页
Electroplating & Pollution Control
关键词
熔融盐
电镀铝
铝枝晶
沉积
电解质
Inorganic solvent
Molten salt
Electroplating
Aluminium (Aluminium alloy)