摘要
The crystal structures of the complexes of [Au(Et XA)(PPh3)2] (1), and [Cu(Et XA)(PPh3)2] (2), have been determined by X ray crystallography. They are isomorphous. The crystal structures are very similar and consist of discrete molecules of [Au(Et XA)(PPh3)2] and [Cu(Et XA)(PPh3)2], respectively. They all display distorted tetrahedral geometry around the central metal atom. In the complexes, the ethylxanthate ions act as bidentate ligands with their S atoms coordinated to metal. Each forms a four member chelate ring. The P atoms from two triphenylphosphine ligands are coordinated to the metal atom. The Au P bond lengths are 0.2295(2)nm and 0.2329(2)nm, and the Au S bond lengths are 0.2620(3)nm and 0.2846(3)nm, respectively. The Cu P and Cu S bond lengths are 0.2254(1)nm, 0.2273(2)nm, and 0.2375(1)nm, 0.2495(2)nm, respectively. Elemental analysis, electronic and IR spectra are in agreement with the structural data. CCDC: 1, 208728; 2, 208903.
The crystal structures of the complexes of [Au(Et XA)(PPh3)2] (1), and [Cu(Et XA)(PPh3)2] (2), have been determined by X ray crystallography. They are isomorphous. The crystal structures are very similar and consist of discrete molecules of [Au(Et XA)(PPh3)2] and [Cu(Et XA)(PPh3)2], respectively. They all display distorted tetrahedral geometry around the central metal atom. In the complexes, the ethylxanthate ions act as bidentate ligands with their S atoms coordinated to metal. Each forms a four member chelate ring. The P atoms from two triphenylphosphine ligands are coordinated to the metal atom. The Au P bond lengths are 0.2295(2)nm and 0.2329(2)nm, and the Au S bond lengths are 0.2620(3)nm and 0.2846(3)nm, respectively. The Cu P and Cu S bond lengths are 0.2254(1)nm, 0.2273(2)nm, and 0.2375(1)nm, 0.2495(2)nm, respectively. Elemental analysis, electronic and IR spectra are in agreement with the structural data. CCDC: 1, 208728; 2, 208903.
出处
《无机化学学报》
SCIE
CAS
CSCD
北大核心
2003年第7期761-765,共5页
Chinese Journal of Inorganic Chemistry
基金
山东省自然科学基金资助项目(No.Y2002B06)
山东省教育厅重点项目(No.J01C05)资助。
