摘要
介绍了集成电路封装用引线框架级进模的排样设计和模具结构 ,还介绍了凸模、凹模、凸模固定板、卸料板、卸料板座等主要零件的特点 ,此模具结构应用于实践中取得了良好的效果 ,对同类模具的设计制造有一定的借鉴作用。
The layout design and structure of the progressive die for the lead frame used for the IC packaging were introduced. The characteristics of the main parts of the die such as the punch, matrix, punch plate, stripping plate and stripping plate holder were stated. This die structure made good results in application and has certain reference value to the design and manufacture of similar dies.
出处
《模具工业》
北大核心
2003年第10期14-16,共3页
Die & Mould Industry
关键词
引线框架
排样
级进模
lead frame
layout
progressive die