亚微米碳化硅超细粉体的制备及破碎机理探讨

A Study on breakage behavior of sub-micro silicon carbide

通过试验确定了一条使用搅拌球磨机粉碎碳化硅,使被加工物料一次达85%～95%的颗粒小于1μm的工艺路线,粉体质量达到国外同类产品水平。分析讨论了碳化硅的粉碎机理并对研磨粉碎曲线进行回归方程分析,得出两条曲线的回归方程,理论计算曲线与试验曲线吻合度很好。并探讨影响函数关系方程的因素,为实际生产提供了理论依据。

An investigation on the grinding silicon carbide was carried out in stirred ball millsThe results show that the 85%～95% of product particles are less than 1 micro in once through grindingThe breakage behavior of silicon carbide is also discussed in the paperThe experimental data are analysed using regression equationsMathematical description gives good agreement with the observed dataThe study shows the possibility of accurate predication of grinding for industrial production