平面磨削中工件温度场的直接测温

DIRECT MEASUREMENT OF WORKPIECE TEMPERATURE FIELD IN SURFACE GRINDING

平面磨削中工件温度场采用红外成像的电荷偶合装置(CCD)测量.在高空间、瞬时条件下红外辐射(IR)温度测量一直是沿磨削试件一侧进行测定试件表面和次表面的温度.用斜面磨削的方法,使磨削深度持续增加,获得了随材料磨除率而改变的磨削温度的变化.这些测量结果与用传统的恒磨除率磨削试验具有良好的相关性.确定了最高温度的位置和值,包括温度梯度.讨论了确定磨削热模型测量的含意及工件的烧伤苗头的预测.

The temperature field in the workpiece during surface grinding has been measured using a charge-coupled device(CCD) based infra-red imaging system. Infra-red (IR) radiation measurements, at high spatial and temporal resolution, have been made along a side of the grinding specimen to estimate workpiece surface and sub-surface temperatures. By grinding along a taper, with a continuously increasing depth of cut, the variation in grinding temperature with material removal rate has been obtained. These measurements have correlated well with those made in conventional constant material removal rate grinding tests. The location and values of highest temperature, including temperature gradients, have been identified. Implications of the measurements for validating thermal models of grinding, and predicting the onset of thermal damage in the workpiece are discussed.