摘要
重点介绍了目前LTCC技术状态,MCM封装技术的发展,及低温陶瓷性能。使用Au,Ag,Cu等较低电阻率金属材料作导电材料,可以极大地降低插入损耗,并且介电常数比高温共烧陶瓷(HTCC)低,因此可以提高微波信号传输速率,减小信号延迟时间。在提高材料性能方面提出了一些建议和方法。
Recent technology states for LTCC, package development of MCM, and perfor-mances of LTCC are mainly described. Au, Ag, Cu with lower resistivity are used as thick conductorto improve insert loss, it has lower dielectric than HTCC, so it can increase transmission speed ofmicrowave signals and decease signal delay time. Then some suggestions and methods in improvingmaterial performances are proposed.
出处
《半导体技术》
CAS
CSCD
北大核心
2003年第11期71-75,共5页
Semiconductor Technology
关键词
低温共烧陶瓷
微波材料
TCC技术
MCM封装
low temperature co-fired ceramic
insert loss
delay time
microwave perfor-mance
