摘要
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。通过正交试验优化了粘片和键合两个关键工序,保证了产品批量生产的可靠性和工艺一致性。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced. By orthodoxy test, die felting and bonding were optimized, so reliability and process consistence of the batch product were ensured.
出处
《电子质量》
2003年第10期J011-J011,J005,共2页
Electronics Quality
