摘要
介绍了大规模集成电路高低温测试系统的建立,介绍了热流系统的主要技术指标和实用性。重点讨论了集成电路高低温测试系统,实际应用的关键技术及几个应该注意的技术细节。
This paper presents the construction of the high and low temperature testing system of VLSI, as well as the main characteristics of the precision temperature farcing system and its practicability. It focuses on the key application technique of the high and low temperature system of VLSI, and some application know-how as well.
出处
《电子产品可靠性与环境试验》
2003年第5期26-28,共3页
Electronic Product Reliability and Environmental Testing
关键词
高低温测试
热流系统
温度建立时间
high and low temperature testing
temperature foree system
temperature set-up time
