2Lucas B N, Oliver W C, Swindeman J E. The dynamic of frequency-specific, depth-sensing indentation testing. MRS Symposium Proceeding, Vol 522. San Francisco, California: Pennsylvania Materials Research Society, 1998. 3-10.
3Anthony C, Fischer C. Nanoindentation. New York: Spring-Verlag, 2002, 61 -62.
4Oliver W C, Pharr G M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J Mater Res, 1992, 7(6): 1564-1583.
5Landman U, Luedtke W D, Burnham N A, et al. Atomistic mechanisms and dynamics of adhesion, nanoindentation and fracture. Science, 1990, 248:454,461.
6Leng Y S, Yang G P, Hu Y Z, et al. Computer experiments on nano-indentation: a molecular dynamics approach to the elasto-plastic contact of metal copper. Journal of Materials Science, 2000, 35:2061 -2067.
7Gannepalli A, Mallapragada S K. Molecular dynamics studies of plastic deformation during silicon nanoindentation.Nanotechnology, 2001,12:250-257.
8Cheong W C D, Zhang L C. Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentation. Nanotechnology, 2000, 11:173-180.
9Christopher D, Smith R, Richter A. Atomistic modeling of nanoindentation in iron and silver. Nnoteclmology, 2001, 12:372-383.
10Bolshakov A, Pharr G M. Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques. J Mater Res, 1998, 13(4): 1049-1058.
4CHEN Shangda1,2 & KE Fujiu1,2 1. Department of Applied Physics, Beijing University of Aeronautics and Astronautics, Beijing 100083, China,2. State Key Laboratory of Non-linear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, China Correspondence should be addressed to Chen Shangda (email: chensd@lnm.imech.ac.cn) Received August 27, 2003.MD simulation of the effect of contact area and tip radius on nanoindentation[J].Science China(Physics,Mechanics & Astronomy),2004,47(1):101-112. 被引量：4
10CHROMIK R R, WANG D N, SHUGAR A,et al. Meehanical properties of intermetaltie compounds in the Au-Sn system [J]. Journal of Materials Research, 2005,20(8) : 2161-2172.
