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电沉积Al/Fe/Cu多层薄膜的固态扩散研究

Study on solid state diffusion of electrodeposited Al/Fe/Cu multilayers
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摘要  采用AlCl3 NaCl熔融盐镀铝、FeSO4溶液镀铁、CuSO4溶液镀铜得到了结构完整、界面清晰的Al/Fe/Cu多层薄膜。研究了电流密度、时间、温度对镀铝层性能及电流效率的影响。采用X 射线衍射仪对该多层薄膜热处理前后进行了表征,并用金相显微镜对其结构与形貌进行了分析。结果表明,该多层薄膜致密均匀且各层之间结合力良好;通过热处理后得到了一面心立方结构的新相,该新相基本结构与Cu大致相同,且多层薄膜中铁铜质量比越低,越有利于该新相的生成。 Al/Fe/Cu multilayers with perfect structure and clear interface were obtained on Cu material by Al plating from molten salt of AlCl_3-NaCl, Fe plating from FeSO_4 solution and Cu plating from CuSO_4 solution in turn. Effects of current density, time, temperature on behaviors of Al coating and current efficiency were studied. Properties and morphology of the multilayer were investigated with the method of X-ray diffraction(XRD) and metalloscope respectively. Results show that the Al/Fe/Cu multiplayer was fine, uniform and had good adhension; A new phase with structure of face-centered cubic similar to that of Cu was formed in the multilayer after heat treatment. The lower the ratio of Fe weight to Cu weight in the multiplayer, the easier the new phase was formed.
出处 《电镀与涂饰》 CAS CSCD 2003年第5期20-22,29,共4页 Electroplating & Finishing
基金 自然科学基金资助项目(19874018)
关键词 电沉积 AI/Fe/Cu多层薄膜 固态扩散 electrodeposition Al/Fe/Cu multiplayer solid state diffusion
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参考文献5

  • 1张允城 胡如南 向荣.电镀手册(上)[M].北京:国防工业出版社,1997.258-262.
  • 2Klkein T, Symko O G. Formation d Al/Cu/Fe quasicrystalline thin films by solid state diffusion[J].Appl Phys Lett, 1994, 64(4): 431-440.
  • 3Grenet T, Giroud F, Loubet K, et al. Real time study of the quasicrystal formation in annealed AlCuFe metallic multilayers [ A ]. Proceedings of the 7th International Conference on Quasicrystals[C]. Stuttgart, 1999.
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