高温蠕变裂纹扩展参量Q^＊（t）及其应用

Application of Parameter Q * (t) for Correlation of Creep Crack Growth Rate

针对C*参数的不足,本研究修正Q*并得到了一个新的蠕变裂纹扩展速率(CCGR)控制参数Q*(t)。该参数综合了温度、应力场、激活能等影响因素,很好地表征了在不同应力或温度条件下蠕变裂纹扩展的特性。该参数能完整关联整个蠕变裂纹扩展的不同阶段,并从材料蠕变断裂的机制上反映了蠕变裂纹扩展的本质。

A new parameter,Q*(t) is modified from Q* in this paper for correlation with creep crack growth rate (CCGR) instead of C* integral Taking into account of effective factors, including temperature, stress field and activation energy, the new parameter Q*(t) shows a good correlation of creep crack growth rate under various stress levels and temperatures Q*(t) not only reveals the physical mechanism of creep fracture and creep crack growth, but also correlates with the whole stages of creep crack growth