期刊文献+

Characteristics of Ultra-Thin Oxide pMOSFET Device After Soft Breakdown

超薄栅氧化物pMOSFET器件在软击穿后的特性(英文)
下载PDF
导出
摘要 The degradation of MOS transistor operation due to soft breakdown of the gate oxide is studied.Important transistor parameters are monitored under homogeneous stress at different temperature until the soft breakdown occurred.The output and transfer characteristic have small change after soft breakdown as the degradations of drain current and threshold voltage is continuous.However,the increment of gate leakage current increases abruptly after the soft breakdown.The analysis to the increment of gate leakage current after the soft breakdown shows mechanism of similar Fowler Nordheim(FN) tunneling current. 研究了在软击穿后 MOS晶体管特性的退化 .在晶体管上加均匀的电压应力直到软击穿发生的过程中监控晶体管的参数 .在软击穿后 ,输出特性和转移特性只有小的改变 .在软击穿发生时 ,漏端的电流和域值电压的退化是连续变化的 .但是 ,在软击穿时栅漏电流突然有大量的增加 .对软击穿后的栅漏电流增量的分析表明 ,软击穿后的电流机制是 FN隧穿 ,这是软击穿引起的氧化物的势垒高度降低造成的 .
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第11期1149-1153,共5页 半导体学报(英文版)
基金 国家重点基础研究(No.G2 0 0 0 -0 3 65 0 3 ) 教育部博士点基金(No.970 0 0 113 )资助项目~~
关键词 FN tunneling MOSFET soft breakdown ultra thin FN隧穿 MOSFET 软击穿 超薄
  • 相关文献

参考文献13

  • 1..http://www-device. eecs. berkeley. edu/qmcv/html.,.
  • 2Lee S,Cho B,Kim J,et al. IEDM Tech Dig,1994:605.
  • 3Miranda E,Sune J. IEEE Inter Rel Phys Symposium, 2001:367.
  • 4Houssa M, Nigam T, Mertens P W, et al. Appl Phys Lett,1998,73:514.
  • 5Tomita T,Utsunormya H,Sakura T,et al. IEEE Trans Electron Devices, 1999,46 : 159.
  • 6Okada K,Taniguchi K. Appl Phys Lett,1997,70:351.
  • 7Farmer K R,Saletti R,Buhrman R A. Appl Phys Lett,1988,52(20):1749.
  • 8Mort N F,Davis E A. Electronic processes in non-crystalline materials. Clarendon, Oxford, 19 7 9 : 3 2.
  • 9Houssa M,Nigam T,Mertens P W,et al.J Appl Phys,1998,84:4351.
  • 10Sze S M. Physics of semiconductor devices. New York, 1981.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部