摘要
Polarization curves of copper were measured in NH 3·H 2O media containing K 3Fe(CN) 6. Components of passive film were analyzed by XPS. Relation of polishing rate with corrosion current density was investigated during CMP. Copper can be passivated in the slurry and main component of passive film is Cu 4Fe(CN) 6. Relation of polishing rate with corrosion current density is linear direct ratio and expressed as R = KJ corr during CMP. Coefficient K varies with different slurry systems but is constant under experimental conditions, which does not vary with NH 3·H 2O, K 3Fe(CN) 6, γ Al 2O 3 concentrations, polishing pressures and rotative rate in a slurry system during CMP.
Polarization curves of copper were measured in NH 3·H 2O media containing K 3Fe(CN) 6. Components of passive film were analyzed by XPS. Relation of polishing rate with corrosion current density was investigated during CMP. Copper can be passivated in the slurry and main component of passive film is Cu 4Fe(CN) 6. Relation of polishing rate with corrosion current density is linear direct ratio and expressed as R = KJ corr during CMP. Coefficient K varies with different slurry systems but is constant under experimental conditions, which does not vary with NH 3·H 2O, K 3Fe(CN) 6, γ Al 2O 3 concentrations, polishing pressures and rotative rate in a slurry system during CMP.
出处
《中国有色金属学会会刊：英文版》
CSCD
2002年第1期178-182,共5页
Transactions of Nonferrous Metals Society of China
基金
Project ( 5 992 5 412 )supportedbyScienceFundofNationalPreeminentYouth
project ( 98JZY2 16 7)supportedbyScienceandTechnologyFundofExcellectMid youthofHunanProvince
