摘要
Increase in the integration and package density of aviation electronic equipment provides severe challenge to heat control for electronic components, yet the microchannel radiator offers an efficient method for solving the problem of cooling electronic chips and devices. In this paper, 6 micro rectangle channels with different sizes were designed and fabricated; the experiment of single\|phase forced convection heat transfer was conducted with solution of CH\-5OH, the most commonly used coolant for aviation electronic equipment, flowing through those microchannels. The influences of liquid velocity, degree of coolant supercooling, and configuration of microchannels on the heat transfer characteristics were analyzed respectively.
Increase in the integration and package density of aviation electronic equipment provides severe challenge to heat control for electronic components, yet the microchannel radiator offers an efficient method for solving the problem of cooling electronic chips and devices. In this paper, 6 micro rectangle channels with different sizes were designed and fabricated; the experiment of single\|phase forced convection heat transfer was conducted with solution of CH\-5OH, the most commonly used coolant for aviation electronic equipment, flowing through those microchannels. The influences of liquid velocity, degree of coolant supercooling, and configuration of microchannels on the heat transfer characteristics were analyzed respectively.
