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聚甲基丙烯酸甲酯微流控分析芯片的简易热压制作法 被引量:26

Fabrication of Poly(methyl methacrylate)(PMMA) Microfluidic Chips by a Simple Hot Embossing Method
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摘要 提出聚甲基丙烯酸甲酯 ( PMMA)微流控分析芯片的一种简易热压制作法 ,研究了镍基、单晶硅和玻璃 3种阳模制备芯片及芯片的封合条件 .采用扫描电镜 ( SEM)和电荷耦合检测器 ( CCD)对 PMMA芯片的微通道及其横截面形貌进行了表征 .SEM图和 CCD图表明实现了热压封接 .测定了 PMMA芯片的伏安曲线和电渗流 ,其电渗流值与文献报道值基本一致 .本法制作的 PMMA芯片用于电泳分离 Cy5荧光染料 ,峰高RSD为 2 .2 % ( n=1 1 ) ,理论塔板数 7.4× 1 0 4m-1. A cheap commercial pellet press was modified to perform hot embossing for the fabrication of PMMA microfluidic chips, after installing the devices for temperature control and water cooling. Nickel electroplated master molds or microfabricated silicon and glass master molds were mounted on the embossing machine together with PMMA substrates and heated from 128 ℃ to 135 ℃, and pressed in the pressure range from 1.0—1.2 MPa for 30—60 s. After the assembly was cooled to near room temperature, the chip substrate with imprinted microchannels was removed. The complete process took about 15 min. The substrate and its PMMA cover plate were bonded at 88—95 ℃ with 0\^8—1\^4 MPa pressure for 10—15 min. CCD images of microchannels and SEM images of open channels on the substrates and the cross section of chips are given to show the effectiveness of the procedure. The electroosmotic flow and voltage-ampere curves of the PMMA chips corresponded to those reported in the literature. The performance of the PMMA chips is demonstrated in the electrophoretic separation of Cy5 from byproducts with a precision of 2.2% RSD(n=11) and an efficiency of 7.4×10 4 plates/m.
出处 《高等学校化学学报》 SCIE EI CAS CSCD 北大核心 2003年第11期1962-1966,共5页 Chemical Journal of Chinese Universities
基金 国家自然科学基金重大项目 (批准号 :2 0 2 990 3 0 )资助
关键词 聚甲基丙烯酸甲酯 微流控芯片 热压法 形貌表征 电泳分离 芯片材料 Microfluidic chips Simple hot embossing PMMA Electrophoretic separation
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参考文献11

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