磁控溅射膜层厚度均匀性测试

Uniform measurement of film thickness by magnetron sputtering

在相对于平面磁控溅射阴极均匀区范围内安放硅片,镀膜后进行膜层厚度测试,然后计算膜层厚度均匀度。结果,片间厚度均匀性为1%～-1.7%;炉间厚度均匀性为3.5%～-2%。

Silicon pieces are placed in the uniform range relative to magnetron sputtering cathode. After deposition, measure the film thickness, then calculate the uniform of film thickness. As a result, thickness uniform between pieces is 1%～-1.7% and between stoves is 3.5%～-2%.