摘要
概述了芯片尺寸封装(CSP)的基本结构和分类,通过与传统封装形式进行对比,指出了CSP技术具有的突出优点,最后举例说明了它的最新应用,并展望了其发展前景。
Basic structure and classification of chip scale package are summarized in this paper,and its excellent merits are also indicated by comparison with traditional packaging styles. At last,new applications and development foreground of CSP are introduced through some examples.
出处
《半导体技术》
CAS
CSCD
北大核心
2003年第12期39-43,共5页
Semiconductor Technology
基金
江苏省高校自然科学研究基金资助项目(02KJB510005)。
