期刊文献+

一个集成电路工艺诊断实例 被引量:1

An Example on IC Process Diagnosing
下载PDF
导出
摘要 介绍了一种计算机自动 PCM(process control module)工艺参数分析系统 ,可用于集成电路制造过程中的工艺诊断和分析 .在具体处理上应用了主成分分析方法 ,能够从大量数据中提取其统计特征 ,根据这一特征可找出造成工艺波动的关键因素 .从所给出的具体诊断实例来看 ,该方法能够得出一般人工诊断所不能得出的诊断结论 ,效果较好 ,是实施严格生产控制的有效工具 . A computer analysis that deals with the PCM (process control module) parameters is introduced.Since the principal component analysis (PCA) is preferable for extracting information in the IC design field,this multivariate statistic tool is adopted in a similar way to get answers in IC process failure.After the characteristic of the tested PCM data is described by PCA,diagnostic conclusions for a process failure can be easily obtained.This method is illustrated by an example,which is proved successful.The PCA method thus is useful for further IC process diagnosing.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第12期1340-1344,共5页 半导体学报(英文版)
关键词 PCM 工艺诊断 主成分分析 集成电路 PCM (process control module) process diagnosing PCA(principal component analysis)
  • 相关文献

参考文献4

  • 1李庆扬 王能超 等.数值分析[M].武汉:华中理工大学出版社,1988.101-110.
  • 2Singhal K, Visvanathan V. Statistical device models from worst case files and electrical test data. IEEE Trans Semicond Manuf,1999,12(4) :470
  • 3White D A,Goodlin B E,Gower A E,at el. Low open-area endpoint detection using a PCA-based T2 statistic and Q statistic on optical emission spectroscopy measurements.IEEE Trans Semicond Manuf,2000,13(2):193
  • 4Lachman-Shalem S,Himovitch N,Shauly E N,et al. MBPCA application for fault detection in NMOS fabrication. IEEE Trans Semicond Manuf, 2002,15 ( 1 ): 60

共引文献19

同被引文献2

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部