印制板的表面终饰工艺系列讲座 第一讲 印制板的表面终饰工艺简介

Lecture series on final surface finishing process for PCB- 1 Brief introduction of final surface-finishing process for PCB

对印制板表面终饰工艺的概念、面临的挑战及现存的问题进行了阐述,并提出了电子产品的无铅化趋势。介绍了为寻找热风整平替代工艺而进行的工作。

This paper discussed concept, challenges and current problems of final surface finishing process for PCB. Trend of being lead-free for electronic products was proposed. In addition, reseach for finding alternative process to HASL was introduced.