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静态煅烧法除SiC微粉中碳杂质的工艺研究 被引量:1

Investigation of Static Calcine on removing Carbide impurity from Silicon Carbide powder
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摘要 由于SiC在电子半导体方面有较大应用,纯度要求就成为主要限制,尤其是碳杂质的影响。本实验对SiC微粉首先经过不同温度的煅烧测定烧失率确定最佳煅烧温度,然后在最佳煅烧温度下通过不同保温时间测定烧失率确定最佳保温时间,对粉体进行DTA-TG测定分析样品质量变化与温度的关系,最后对实验前后的样品进行XRD物相分析,最终得到除碳最佳煅烧温度900℃,最佳保温时间3h。 SiC has a widespread use in semiconductor and electron,however the impurity of calcine is the main influencing factors,so this firstly the Silicon Carbide powder was calcined at different temperatures in order to get the best calcination temperature.Then the best heat preservation time was determined by evaluating ignition loss at this best calcination temperature.The DTA-TG curve was tested and analysed the relation between weight and temperature.Finally the XRD analysis of the sample before and after experiment were carried out.It is found that the best static calcine temperature is 900℃,and the best time to heat preservation is 3h.
出处 《电子测试》 2013年第3X期219-220,共2页 Electronic Test
关键词 静态煅烧法 SIC 碳杂质 Static Calcine Method SiC Impurity of Carbide
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  • 1童长青,刘永胜,王晓刚,李晓池.煤矸石/石英砂与无烟煤合成β-SiC微粉研究[J].龙岩学院学报,2005,23(6):54-56. 被引量:3
  • 2江东亮 增刊).高性能陶瓷的结构设计和相应的制备科学[J].稀有金属材料与工程,2001,30:344-344.
  • 3陶长远 刘达清.碳化硅薄膜很优秀[N].科技日报,2002-01-07.
  • 4井P孝喜.SiC材料の_kと特征[A].日本学术振兴会第124委员会编.SiC系新材料最近の展开[C].,2001.2.
  • 5Martinez V, Ordonez S, Castro F, et al. Wetting of silicon carbide by copper alloys [ J 1. Journal of Materials Science,2003,38:4047- 4054.
  • 6Kock T, Brendel A, Bolt H. Interface reactions between silicon carbide and inter-layers in silicon carbide-copper metal-matrix composites [ J ]. Journal of Nuclear Materials ,2007,362 : 197-201.
  • 7Zhu J H, Liu L, Shen B. Mechanical properties of Cu/SiCp composites fabricated by composite electroforming [J]. Materials Letters, 2007,61: 2804 -28O9.
  • 8Gleen S. Fabrication of CuSiC metal matrix composites[ J]. Journal of Materials Mater Science,2006,41:485-504.
  • 9Zhu J H, Liu L, Shen B, et al. Mechanical properties of Cu/SiCp composites fabricated by composite electroforming [ J ]. Materials Letters, 2007, 61 : 2804-2809.
  • 10Zhang R, Gao L, Guo J K. Thermodynamic behavior of copper-coated silicon carbide particles during conventional heating and spark plasma sintering [ J ]. Journal of American Ceramic Society, 2003,86 ( 8 ) : 1446 -1448.

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