摘要
近年来,随着电子元器件的小尺寸化与组装的高密度化,SMT的工艺窗口日趋缩小,组装难度亦越来越大。在此背景下,探讨如何减少SMT产品缺陷率及返修率,并尽可能提高SMT产品的质量,就显得尤为重要。本文在分析SMT产品缺陷的基础上,针对性的提出了几个可有效提高SMT产品质量的对策。
Nowadays,with the high density of small size and assembly of electronic components,the window of SMT process is becoming smaller.As a result of this factor,the assembly is becoming more and more difficult.In this background,exploring how to reduce the SMT production’s defect rate and repair rate is special important.Based on the analysis of the SMT product defects,this paper proposes several countermeasures.
出处
《电子测试》
2014年第9X期150-152,共3页
Electronic Test