摘要
TFT-LCD行业中,彩膜工艺玻璃基板在各线传输过程中,由于各种原因,很容易出现划伤的情况,划伤分为膜面划伤(基板表面的光刻胶被划伤)和基板划伤(基板本身被划伤)两种:膜面划伤按照严重程度进行Rework判定,基板不报废;而Glass本身被划伤,很容易在后续跑片中发生碎片,污染重要设备,因此划伤Glass需立刻报废处理。目前的分辨膜面划伤和基板划伤的主要方法为:工程师在宏观检测机(Macro)内通过强光照射,人眼进行观察。这种方法只能分辨程度很重和程度很轻的划伤,并且准确率不高,很容易由于判断错误导致基板在后续跑片时破损在重要设备(涂布机、曝光机等)处,引起产线严重Down机。本文作者提出一种能够准确鉴别膜面划伤和基板划伤的设备及方法,通过探针在恒定压力作用下伸入光刻膜和Glass表面的速度的不同,准确区分出探针接触的为光刻膜还是Glass表面,以此确定划伤是否伤及Glass。这种方法自动化高,准确度高,能够准确区分出基板划伤,避免后续影响产线正常运行。
In the TFT-LCD industry, color filter process glass substrate in the transmission process, due to various reasons, it is prone to scratches, scratch into surface scratches(photoresist substrate scratched) and substrate scratch(substrate itself is scratched) two: membrane surface scratch according to the severity of Rework determination no, the substrate scrapped; while the Glass itself is very easy to scratch, in the subsequent run in occurrence of debris, important equipment pollution, so scratch Glass immediately scrapped.At present, the main methods to distinguish film surface scratch and substrate scratch are: engineers in the macro testing machine(Macro), through the glare of light, the human eye to observe.This method can distinguish the degree of heavy and very light scratches, and the accuracy rate is not high, it is easy to judge due to error caused in the subsequent run when the substrate breakage in the important equipment(coating machine, exposure machine, etc ) caused by severe Down machine production line The author of this paper proposed equipment and method can accurately distinguish membrane surface scratches and scratches the substrate, through the probe at constant pressure and speed into the photoresist films on the surface of Glass different, accurately distinguish probe contact for photoresist films or Glass surface, in order to determine whether the scratch and Glass The method has high automation and high accuracy, and can accurately distinguish the scratch of the substrate and avoid subsequent influence on normal operation of the production line.
出处
《电子测试》
2017年第11X期16-17,54,共3页
Electronic Test
关键词
基板划伤
膜面划伤
探针
Substrate scratching
film surface scratching
probe