电化学浸渗法制备纤维/铜基复合材料

FIBER-REINFORCED COPPER MATRIX COMPOSITES FABRICATED BY ELECTROCHEMICAL INFILTRATION TECHNIQUE

基于电化学浸渗技术(ECI)在室温下制备了连续铜纤维、碳纤维和玻璃纤维增强铜基复合材料。实验结果表明,在本实验工艺条件下可获得致密的纤维/Cu基复合材料,并具有优良的力学性能。复合材料的断口形貌及显微结构的SEM观察表明,纤维与铜基体之间的界面结合良好,纤维不受任何损伤。证实了ECI在室温下快速制备纤维增强金属基复合材料的可行性。

Continuous-fiber-reinforced Cu matrix composites were fabricated by the electrochemical infiltration technique (ECI). The experimental results show that the dense fiber/Cu composites have been obtained on the present process condition, which possess good mechanical properties. The fracture surface morphology and the microstructures of the composites have been observed by SEM. It is indicated that the interfacial bond between fibers and Cu matrix is very well and the fibers do not have any damage. The ECI is feasible to prepare rapidly fiber-reinforced metal matrix composites at room temperature.