CuW/CrCu自力型整体触头界面还原及结合强度

The Interface Reduction and Bonding Strength of CuW/CrCu Self-Elastic Solid Contact

自力型CuW/CrCu整体弧触头的立式熔接工艺是指在立式气氛可控烧结炉内对CuW触头部分与尾部CrCu熔结的过程,是制造整体触头的关键技术。Cuw/CrCu整体弧触头的立式熔接首先要对CuW合金的界面进行还原处理,以清除在熔接前由于种种原因界面上出现的氧化夹杂等,确保界面的良好结合;尾部CrCu的Cr含量是影响CuW/CrCu界面结合强度的另一重要因素,适当的Cr含量是必须的。

The vertical bonding process by malting in the key process for manufacturing solid contacts. The contact of CuW was bonded with the tail of CrCu by malting in a vertical atmosphere-controllable sintering furnace. The interface of CuW alloy should be treated firstly by reduction during the bonding process, in order remove the oxides impurities existed on the interface and get a good interface bonding. The Cr content of the CrCu tail is another important factor affecting the bonding strength between CuW/CrCu interface. It is necessary to have a suitable Cr content.