摘要
本文介绍有限元中的 2D -Plane42模型在CBGA组件热变形中的应用 ,利用有限元的模拟CBGA组件的应变、应力的分布 ,通过模拟表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法。
In this paper, 2-D PLANE42 model of finite element simulation analysis applied in thermal deformation of ceramic ball grid array (CBGA) assembly is presented. The finite element method is used to simulate distribution of strain and stress of CBGA, the simulation indicates the finite element simulation analysis is a method in studying reliability of the solder joint for ball grid array (BGA) and the CBGA assembly in packaging of microelectronics.
出处
《微电子技术》
2003年第6期63-65,54,共4页
Microelectronic Technology
