摘要
采用Ti/Cu/Ti中间层在1273K、180min的条件下,改变Ti箔厚度进行Si3N4陶瓷的部分瞬间液相(PTLP)连接,讨论Ti箔厚度对界面结构及连接接头强度的影响,用扫描电镜、电子探针对连接界面区域进行了分析。结果表明,在试验范围内,Ti箔厚度为10μm时Si3N4/Ti/Cu/Ti/Si3N4接头的室温强度最高,为210MPa。PTLP连接时,当连接温度和时间不变,且连接时间能保证等温凝固过程充分进行的条件下,Si3N4/Ti/Cu/Ti/Si3N4连接界面结构、反应层厚度、等温凝固层厚度随着Ti箔厚度改变而改变。
Partial transient liquid-phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was performed by changing the thickness of Ti foil.The effect of Ti foil thickness on interface structure and joint strength was discussed.The joint interfaces were analyzed by SEM and EPMA.The results show that under the experimental conditions high joint strengthen 210 MPa is obtained at room temperature.When bonding temperature and time was not changed and the process of isothermal solidification was carried completely,interface structure, reaction layer thickness and isothermal solidification thickness were changed with the change of Ti foil thickness.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2003年第6期19-22,共4页
Transactions of The China Welding Institution
基金
江苏省自然科学基金项目(BK201087)
关键词
部分瞬间液相连
钛箔厚度
陶瓷
界面结构
连接强度
partial transient liquid phase bonding
silicon nitride
Ti foil thickness
interfacial structure,bonding strength
