2BRYZEK J. Impact of MEMS technology on society[J].Sensors and Actuators A.1996, 56: 1-9.
3O'NEAL C B, MALSHE A P, SINGH S B, et al.Challenges in the packaging of MEMS[A]. 1999 Int Symp on Advanced Packaging Materials[C]. Georgia,USA ,1999, 41-47.
4RAMESHAM R, GHAFFARIAN R. Challenges in interconnection and packaging of MEMS[A].Proc of the50th Electronic Components and Technology Conf[C]. Las Vegas, Nevada, 2000,666-675.
5CHEN M X, CHEN S H, YI X J, et al. Eutectic bonding on large silicon die using deposited gold-tin multilayer composites[A]. 5th Intl Conf on Electronic Packaging Technology[C]. Shanghai, China,2003,147-150.
7LASKY J B.Wafer bonding for silicon-insulatortechnologies[J].Appl Phy s Lett,1986,48(1):78-80.
8WANG X F, ZHU F L. Study on plasma cleaning andstrength of wire bonding[A]. 2004 Int Conf on theBusiness of Electronic Product Reliability and Liability[C]. 2004, Shanghai, China (accepted).
9SONG X, LIU S. A performance prediction model for apiezoresistive transducer pressure sensor[A]. ICEPT'03, Proceof the 5th Int Conf on Electronic Packaging Technology[C]. 2003, Shanghai, China,30-35.
10Knutti J W. "Finding Markets for Microstructures," Proceedings of the SPIE Conference on Micromachining and Microfabrication Process Technology[C]//IV, Vol. 3511, Santa Clara, CA, USA, 17-23, 1998.