二甲基甲酰胺中Eu-Bi合金薄膜的电化学制备研究

Study on Electrochemical Preparation of Eu - Bi Alloy Films in N,N - dimethylformide

利用循环伏安法和恒电位沉积法探讨了353K时在EuCl30.1mol/L)-Bi(NO3)3(0.05mol/L)-二甲基甲酰胺-LiClO4体系中Eu-Bi合金薄膜的电化学制备。研究了沉积时的电流密度、沉积时间、以及Eu(Ⅲ)的浓度比对沉积膜质量的影响。实验结果表明,在EuCl3(0.13 mol/L)-Bi(NO3)3(0.06 mol/L)-二甲基甲酰胺-LiClO4体系中,当控制恰当的沉积条件,均可得到表面均匀、附着力强、有金属光泽的黑色非晶态Eu-Bi合金膜,其中Eu的质量分数可达10.56、wt％-34.24wt％,所得到的沉积膜通过SEM,EDS和XRD进行分析。

The cyclic voltammetry and potentiostaic electrolysis was used to investigate the preparing of Eu -Bi alloy films in EuCl3(0.1 mol/L) -Bi(NO3)3(0.05 mol/L) -DMF-LiClO4 system at 305 K. The effects of several factors of Eu in Eu- Bi alloy films including the current density,deposition time and concentration ration of EuCl3/Bi(NO3)3 have been studied, Experimental results indicate that Eu - Bi alloy films containing Eu 10.56 wt% -34.24 wt % was prepared in EuCl3(0.1 mol/L) - Bi(NO3)3(0.05 mol/L) -DMF- LiClO4 system by controlling deposition conditions. The are black, uniform. metallic luster and adhere firmly to the copper substrates analyzed by SEM.EDS and XRD.