期刊文献+

化学沉积Ni-P膜电阻器热处理工艺研究

A STUDY ON THE HEAT TREATMENT TECHNOLOGY OF ELECTROLESS DEPOSITED Ni—P FILM RESISTORS
下载PDF
导出
摘要 研究热处理工艺对化学沉积金属膜电阻器的温度系数和潮湿系数的影响。发现热处理工艺可使Ni-P膜电阻器获得优良的电性能。对热处理前后的Ni-P膜层做了电子衍射分析,探讨了热处理前后的微观结构。 In this paper, the effects of heat treatment on the temperature coefficient (TCR) and moisture cofficient of resistance (MCR) of metal film resistors made by electroless plating are studied. It has been found that the excellent properties of the electroless Ni-P film resistor can be obtained by heating it for several hours at a certain temperature. By means of TEM the electron diffraction patterns of the Ni-P film before and after the treatment are obtained and studied. The microcosmic structure of the Ni-p film before and after the treatment are studied.
出处 《天津大学学报》 EI CAS CSCD 1992年第1期101-105,共5页 Journal of Tianjin University(Science and Technology)
关键词 化学沉积 电阻器 镍-磷膜 热处理 electroless plating, temperature coefficient (TCR), moisture coefficient (MCR), heat treatment technology, diffraction pattern
  • 相关文献

参考文献1

共引文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部