摘要
研究了去除铜粉表面氧化层后 ,在铜粉干燥、贮存、制备成导电涂料和导电涂层过程中防止铜粉氧化的还原剂法、偶联剂包覆法、配合剂法等方法对铜粉防氧化性和涂层导电性的影响。
This article has discussed the influence of various processes for protection of the oxidation of copper powder (after removing of oxidation layer) during formulation of conductive coatings and formation of conductive coatings layer, such addition of reductant, coating with coupling agent, and mixing with compounding ingredient.
出处
《涂料工业》
CAS
CSCD
2004年第1期16-18,共3页
Paint & Coatings Industry
关键词
导电涂料
铜粉
防氧化
涂层
性能
后处理工艺
Conductive coatings, copper powder, protection of the oxidation