摘要
讨论了高性能微惯性器件单片集成技术。首先对单片集成MEMS技术的优势及面临的困难进行了讨论,并对目前主流的单片集成MEMS技术特点、工艺流程进行了介绍,最后,给出高性能微惯性器件单片集成技术的未来发展趋势。
The-monolithic-integration-technology-of-high-performance-micro-inertial-device-is-presented.-Firstly,-the-advantages-and-difficulties-faced-by-the-technology-of-monolithic-integration-MEMS(Micro-Electro-Mechanical-Systems)-are-discussed.-Secondly,-the-features-and-the-process-of-the-mainstream-monolithic-integration-MEMS-technology-are-introduced.-Finally,-a-forecast-is-put-forward-on-the-future-trends-of-high-performance-micro-inertial-device.
出处
《太赫兹科学与电子信息学报》
2014年第4期622-626,共5页
Journal of Terahertz Science and Electronic Information Technology
基金
中国工程物理研究院科学技术发展基金重点课题(20111A0403017)
关键词
微机电系统
单片集成
微惯性器件
表面微机械加工
体硅微机械加工
Micro-Electro-Mechanical Systems(MEMS)
monolithic integration
micro-inertial devices
surface micromachining
bulk micromachining
