电子元器件密封试验的探讨与实践

Seal test of electronic components in Destructive Physical Analysis

电子元器件是军工电子产品中的重要组成部分,元器件质量的好坏直接影响到各种装备的质量且对各产品的可靠性有较大影响。密封性能是密封电子元器件质量好坏的重要标志。本文介绍了电子元器件破坏性物理分析密封试验中方法的运用、实践,总结了细检漏和粗检漏试验中应注意的问题及应对措施,从而更有效地剔除有密封缺陷的元器件,保证检测结果的准确性。

Electronic components are the important part of military electronics products, whose quality will directly affect the quality of various types of equipment and has a great impact on the reliability of the products. Sealing performance is an important index of the quality of the sealed electronic components. The application and practice of the seal test method of the Destructive Physical Analysis(DPA) for electronic components are introduced in this paper. The problems which should be paid attention to and the countermeasures in the fine leak detection and crude leak test are concluded.