摘要
通过对电子元器件破坏性物理分析(DPA)试验中发现的混合电路中塑封器件检查、X射线检查密封宽度判据、剪切强度判据和半导体二极管芯片目检等问题进行分析、探讨,加强对DPA试验评价电子元器件固有可靠性机理的认识,以实现恰当、灵活运用标准开展DPA工作。
The problems of the test of the plastic encapsulated device in hybrid circuit,the criteria of the sealing width in X-ray inspection,the criteria of shear strength and visual inspection of semiconductor diode in Destructive Physical Analysis(DPA) of electronic components are discussed and analyzed. The understanding on the DPA evaluating principles for the natural quality of electronic components is improved,which will help the flexible use of standards in DPA.
出处
《太赫兹科学与电子信息学报》
2016年第1期155-158,共4页
Journal of Terahertz Science and Electronic Information Technology
关键词
破坏性物理分析
塑封器件
密封宽度
剪切强度
半导体二极管
Destructive Physical Analysis
plastic encapsulated device
sealing width
shear strength
semiconductor diode
