塑封IC潮敏分级及相应的使用要求

Moisture Sensitive Level for Plastic IC and Some Application Notes

参考JEDEC标准,介绍和讨论塑封IC器件的潮敏问题,如潮敏分级,相应的包装要求,SMT回流焊温度曲线等。对涉及潮敏IC器件的电子组装应用实践中的一些问题提出参考意见。

Refer to related JEDEC standards, some issues for plastic IC - such as moisture sensitive level, packing requirements, SMT reflow profile and reworking - are introduced and discussed. Also some application notes for the board assembly of moisture sensitive devices are provided for reference.