高速芯片模块热管散热器的数值传热分析

Thermal simulating analysis on heat pipe heat sink for high-speed chip module

利用大型FEM软件ANSYS对某高速芯片模块的热管散热器进行仿真热分析,得出了相应的温度场分布图和热流密度分布图。结果表明:热管散热器能有效地降低高速芯片模块在使用时的温度,增加系统的可靠性,是高速芯片模块散热系统的一种新方法。

On the basic of ANSYS program of FEM, thermal simulating analysis on the heat pipe heat sink for high-speed chip module has been made. Temperature distribution and flux distribution of the surface of chip module with heat sink were acquired. The results showed that the surface temperature chip module can be reduced efficiently with heat pipe heat sink and the system reliability can be enhanced. Heat pipe heat sink offer a new method for the high-speed chip module system.