摘要
分析半导体上箱形件Housing15 3 0的工艺结构及特点 ,通过MIM工艺优化和选择粘结剂系统 ,以及采用SPC技术控制注射成形工艺参数与注射件重量 ,使得烧结后所得到的箱形件产品尺寸精度 (线性公差 )达到± 0 2 % ,极大地提高生产效率 ,节约材料 。
The MIM process of Housing 1530 is analyzed in this article.The optimization of process,choice of binder system and SPC technology for injection molding & the weight controlling of green part is applied to the MIM process After sintering,the linear tolerance of ±0 2% of Housing1530 is reached,can save the raw materials a great quantity and decrease cost,and the productivity is increased highly
出处
《现代制造工程》
CSCD
北大核心
2004年第1期51-54,共4页
Modern Manufacturing Engineering
