摘要
文章着重考察了影响搭接条电气性能的几个参数R、L和C,及其与结构尺寸的关系;并给出了典型搭接系统的等效电路图,分析其产生谐振的条件。衡量一个搭接系统是否有效的评定标准是搭接效能,一个正的搭接效能值表示搭接条是有效的。通过实例测试,发现搭接效能的评定与搭接阻抗的评定是一致的,因此,可以用搭接的阻抗特性来衡量搭接系统的有效性。
This paper describes the basic parameters (R,L and C) of a typical bond strap versus dimensions. The equivalent circuit of a bonding system at RF and its resonant conditions are also discussed. Whether a bonding network acts effectively or not can be measured by bonding effectiveness.Through actual tests, we find the measured bonding impedance characteristics can be used as a measure of the effectiveness of the bonding network.
