封装光纤线圈的胶粘剂对光纤产生的热应力影响

Thermal-stress Effect of Package Optical Fiber Coil Adhesive on Optical Fiber

分析了外加应力对光纤消光比的影响,对封装后的光纤线圈建立了简化的力学模型。根据弹性力学原理,利用有限元分析方法对其进行热应力分析,结果表明通过减小胶粘剂的热变形量可以减小对光纤的热应力影响。此外还进行了实验验证,所得实验结果与理论分析基本符合。

The effects of external stress on modal polarization properties of optical fiber are analyzed. A simplified mechanical model has been proposed for the analysis of thermal-stress based on the theory of elasticity. The results show that the effect of thermal-stress on optical fiber can be reduced through decreasing the thermal deformation of adhesive. Moreover, the results of experiment consist with that of theoretic analysis.